DT-101C is a professional starter additive designed for initial preparation and replenishment of acid copper plating baths. It rapidly establishes balanced electrolyte composition, enabling immediate stable production. This product provides a reliable foundation for consistent copper deposition, supporting both new bath commissioning and ongoing replenishment in industrial plating operations.

Applications: • New Bath Make-up • Copper Plating Line Commissioning • Automotive Components • Hardware • Industrial Metal Parts

Features: • Fast bath activation • Stable operating performance • Easy dosing • Compatible with conventional acid copper processes • Rapid commissioning • Reliable foundation

Technical Data: Make up: 6-8ml/L; Temperature: 18-30°C